Slag is metallic impurities formed on the solder surface. These substances are formed by the oxidation of Tin and Lead as a result of contact with air. Slag formation depends on the shape and properties of the solder pot. For example, the area of the solder surface in contact with the air, whether the wave flows regularly or not. As the amount of slag in a ladle increases, the rate of oxidation and thus the formation of new slag accelerates. For this reason, the accumulated slag should be cleaned frequently and the decreasing solder level should be brought to the required level with additional solder.
The dross also damages the soldering process and the solder wave. If the solder accumulates as much as the pump can pull, it quickly wears the pump assembly. In addition, the soldering wave runs unevenly and the soldering uniformity is lost. Large pieces of slag stick to the bottom of the printed circuit boards, causing short circuit and a~ formation.
Use SOLDEX Slag Release Powder to minimize the amount of solder accumulating as slag in the solder pot.
Approximate Length of 1kg Soldering Wire (m)
| Sn60 Pb40 | Sn63 Pb37 | Sn99,3 Cu0,7 | Sn96,5 Ag3 Cu0,5 | ||||||||
| Tel Çapı | 1m Ağırlık | 1kg Uzunluk | 1m Ağırlık | 1kg Uzunluk | 1m Ağırlık | 1kg Uznluk | 1m Ağırlık | 1kg Uzunluk | |||
| 0,50mm | 1,59gr | 628m | |||||||||
| 0,75mm | 3,66gr | 273m | 3,60gr | 278m | 3,05gr | 328m | |||||
| 1,00mm | 6,48gr | 154m | 6,40gr | 156m | 5,37gr | 186m | |||||
| 1,20mm | 8,80gr | 114m | 8,70gr | 115m | 7,49gr | 134m | |||||
To Calculate the Length of 1kg Soldering Wire;
To calculate the approximate length of 1kg of solder wire, we weigh 1m of solder wire.
1.000gr ÷ Weighing Result (1m Wire Weight) = 1kg Solder Wire Length
The dimensions given here are valid for SOLDEX Soldering Wires and the measurement is presented theoretically. It does not specify absolute values.
| SOLDERING STANDARDS | British BS 219 Grade KP | U.S.ASTM Grade A | German DIN 1707 | Japan JIS Z-3283 | |
| Cu | Copper | 0,08% | 0,06% | 0,08% | 0,05% |
| Bi | Bismuth | 0,1% | 0,25% | 0,25% | 0,05% |
| Fe | İron | 0,02% | 0,02% | 0,02% | 0,02% |
| Ag | Silver | No Limit | No Limit | No Limit | No Limit |
| Cd | Kadmiyum | 0,05% | No Limit | No Limit | |
| Al | Aluminum | 0,001% | 0,005% | 0,005 Total% | 0,005% |
| Zn | Zink | 0,003% | 0,005% | 0,005% | |
| Sb | Antimuan | 0,2% | 0,12% | 0,12% | 0,3% |
| As | Arsenic | 0,03% | 0,02% | 0,02% | 0,03% |
| P | Phosphorus | ||||
| S | Sulfur | Zaralı | |||
| O | Oxide | ||||
| Au | AGold | 0,08% | No Limit | 0,08% | No Limit |
Soldering Methods
For a good soldering, the surface should be clean and the soldering operation should be completed in about 2 seconds on electronic parts. After electronic soldering, the soldering elements must be visible and bridged with the component feet, the soldering surface must be shiny. It is very important for the soldering quality that the solder alloy used is pure and within the framework of standards. High purity imported, test certified A Grade tin and lead raw materials are used in SOLDEX solder rods and wires.
|
1 |
1.1 | Soldering iron |
| 1.2 | Heat transfer in preheated blocks | |
| 1.3 | Roller transfer | |
|
2 |
2.1 | Dip |
| 2.2 | Wave | |
| 2.3 | Dragging | |
| 2.4 | Ultrasound | |
| 2.5 | Surface bonding | |
| 3 | 3.1 | Flame |
| 3.2 | Hot |